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 AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Features
* * * * * * * * * * Wide input voltage range: 1.5V - 6V Low RDS(ON): 80m typical @ 5V Turn-on slew rate controlled AP2281-1: 1ms turn-on rise time AP2281-3: 100us turn-on rise time with internal discharge Very low turn-on quiescent current: << 1uA Fast load discharge option Temperature range -40C to 85C SOT26: Available in "Green" Molding Compound (no Br, Sb) Lead Free Finish/ RoHS Compliant (Note 1)
Description
The AP2281 slew rate controlled load switch is a single P-channel MOSFET power switch designed for high-side load-switching applications. The MOSFET has a typical RDS(ON) of 80m at 5V, allowing increased load current handling capacity with a low forward voltage drop. The turn-on slew rate of the device is controlled internally. The AP2281 load switch is designed to operate from 1.5V to 6V, making it ideal for 1.8V, 2.5V, 3.3V, and 5V systems. The typical quiescent supply current is only 0.01uA.
Applications
* * * * * * Smart Phones PDA Cell Phones GPS Navigators PMP/MP4 Notebook and Pocket PC
Ordering Information
AP2281 - X X X X
Turn-on rise time 1 : 1ms 3 : 100us
Note:
Package W : SOT26
Lead Free G : Green
Packing - 7 : Tape & Reel
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
Device AP2281-1W AP2281-3W
Note:
Package Code W W
Packaging (Note 2) SOT26 SOT26
7" Tape and Reel Quantity Part Number Suffix 3000/Tape & Reel -7 3000/Tape & Reel -7
2. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf
AP2281 Rev. 1
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JANUARY 2008
(c) Diodes Incorporated
AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Pin Assignments
(Top View) OUT 1 GND 2 EN 3 SOT26 6 IN 5 GND 4 IN
Pin Description
Pin Name OUT GND EN IN Pin Number 1 2, 5 3 4, 6
Description Voltage output pin. This is the pin to the P-channel MOSFET drain connection. Bypass to ground through a 0.1uF capacitor. Ground. Enable input, active high Voltage input pin. This is the pin to the P-channel MOSFET source. Bypass to ground through a 1F capacitor.
Options
Part Number
AP2281-1 AP2281-3
Slew Rate (typ)
1ms 100us
Active pull down
no yes
Enable
Active high Active high
AP2281 Rev. 1
2 of 9 www.diodes.com
JANUARY 2008
(c) Diodes Incorporated
AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Block Diagram
IN
Slew Rate Control
OUT
GND
Typical Application Circuit
VIN
IN OUT
VOUT
1uF
Enable EN GND
AP2281 Rev. 1
3 of 9 www.diodes.com
For AP2281-3 only
0.1uF
EN
JANUARY 2008
(c) Diodes Incorporated
AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Absolute Maximum Ratings
Symbol VIN VOUT VEN Iload TJ TST PD
Note:
Parameter Input voltage Output Voltage Enable Voltage Maximum Continuous Load Current Operating Junction Temperature Range Storage Temperature Range Power Dissipation SOT26 (Note 3, 4)
Ratings 6.5 VIN + 0.3 6.5 2 -40 ~ 125 -65 ~ 150 720
Unit V V V A C C mW
3. TJ, max =125C. 4. Ratings apply to ambient temperature at 25C.
Recommended Operating Conditions
Symbol VIN IOUT TA Parameter Input voltage Output Current Operating Ambient Temperature Min 1.5 0 -40 Max 6.0 2.0 85 Unit V A C
Electrical Characteristics
(TA = 25 C, VIN = 5.0V, unless otherwise stated) Symbol IQ ISHDN ILEAK RDS(ON) VIL VIH ISINK TD(ON) TON TD(OFF) RDISCH JA JC
Note:
o
Parameters Input Quiescent Current Input Shutdown Current Input Leakage Current Switch on-resistance EN Input Logic Low Voltage EN Input Logic High Voltage EN Input leakage Output turn-on delay time Output turn-on rise time Output turn-off delay time Discharge FET on-resistance Thermal Resistance Junction-to-Ambient Thermal Resistance Junction-to-case
Test Conditions VEN = VIN, IOUT = 0 VEN = 0V, OUT open VEN = 0V, OUT grounded VIN = 5.0V VIN = 3.3V VIN = 1.8V VIN = 1.5V VIN = 1.5V to 6V VIN > 2.7V VIN = 1.5V to 2.7V VEN = 5V Rload = 10 AP2281-1, Rload = 10 AP2281-3, Rload = 10 Rload = 10 For AP2281-3 only, VEN = GND SOT26 (Note 5) SOT26 (Note 5)
Min
Typ. 0.01 0.01 0.01 80 95 160 210
Max 1 1 1 100 120 210 280 0.4
2.0 1.4 1 1000 100 0.5 65 153 29
1 1500 150 1 100
Unit A A A m m m m V V V A S S S S
o
C/W C/W
o
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
AP2281 Rev. 1
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(c) Diodes Incorporated
AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Typical Performance Characteristics
Quiescent Current vs. Input Voltage
0.010
Quiescent Current vs. Temperature
Quiescent Current ( A)
VIN=1.8V 0.008 VIN=3.3V VIN=5.0V 0.006
0.01
Quiescent Current ( A)
0.008
0.006
0.004
0.004
0.002
0.002
0 1.0 2.0 3.0 4.0 5.0 6.0
Input Voltage (V)
0.000 -50
-25
0
25
50
75
100
125
Temperature (C)
R DS(ON) vs. Input Voltage
300.00 I=100mA 250.00 I=500mA I=1A
RDS(ON) vs. Temperature
200.00 180.00 160.00
RDS(ON) (m )
I=2A 200.00
RDS(ON) (m )
140.00 120.00 100.00 80.00 60.00 40.00 20.00 VIN =1.8V VIN =3.3V VIN =5V
150.00
100.00
50.00 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
0.00 -50
-25
0
25
50
75
100
Input Voltage (V)
Temperature (C)
ENABLE Threshold vs. Input Voltage
1.8
0.010
ON/OFF Threshold (V)
Input Shutdown Current vs. Temperature
1.6 1.4
ISHDN ( A)
VIL (V) VIH (V)
0.008 0.006 0.004 0.002 0.000 -50 -25 0 25 50 75 100 125
1.2 1.0 0.8 0.6 0.4 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input Voltage (V)
Temperature (C)
AP2281 Rev. 1
5 of 9 www.diodes.com
JANUARY 2008
(c) Diodes Incorporated
AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Typical Performance Characteristics
AP2281-1 Turn-On
(VIN=3.3V, RL=7)
(Continued)
AP2281-1 Turn-Off
(VIN=3.3V, RL=7)
VEN (5V/div)
VEN (5V/div)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div) IIN (500mA/div)
Time (500s/div)
Time (50s/div)
AP2281-1 Turn-On
(VIN=5V, RL=10)
VEN (5V/div) VEN (5V/div)
AP2281-1 Turn-Off
(VIN=5V, RL=10)
VOUT (2V/div) VOUT (2V/div)
IIN (500mA/div) IIN (500mA/div)
Time (500s/div)
Time (50s/div)
AP2281 Rev. 1
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(c) Diodes Incorporated
AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Typical Performance Characteristics
AP2281-3 Turn-On
(VIN=3.3V, RL=7)
(Continued)
AP2281-3 Turn-Off
(VIN=3.3V, RL=7)
VEN (5V/div)
VEN (5V/div)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div) IIN (500mA/div)
Time (50s/div)
Time (50s/div)
AP2281-3 Turn-On
(VIN=5V, RL=10)
VEN (5V/div) VEN (5V/div)
AP2281-3 Turn-Off
(VIN=5V, RL=10)
VOUT (2V/div) VOUT (2V/div)
IIN (500mA/div) IIN (500mA/div)
Time (50s/div)
Time (50s/div)
AP2281 Rev. 1
7 of 9 www.diodes.com
JANUARY 2008
(c) Diodes Incorporated
AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Application Note
Input Capacitor A 1F capacitor is recommended to connect between IN and GND pins to decouple input power supply glitch and noise. The input capacitor has no specific type or ESR (Equivalent Series Resistance) requirement. However, for higher current application, ceramic capacitors are recommended due to their capability to withstand input current surges from low impedance sources, such as batteries in portable applications. This input capacitor must be located as close as possible to the device to assure input stability and less noise. For PCB layout, a wide copper trace is required for both IN and GND. Output Capacitor A 0.1F capacitor is recommended to connect between OUT and GND pins to stabilize and accommodate load transient condition. The output capacitor has no specific type or ESR requirement. The amount of the capacitance may be increased without limit. For PCB layout, the output capacitor must be placed as close as possible to OUT and GND pins, and keep the traces as short as possible. ENABLE/SHUTDOWN Operation The AP2281 is turned on by setting the EN pin high, and is turned off by pulling it low. To ensure proper operation, the signal source used to drive the EN pin must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH. Power Dissipation The device power dissipation and proper sizing of the thermal plane is critical to avoid thermal shutdown and ensure reliable operation. Power dissipation of the device depends on input voltage and load conditions and can be calculated by:
PD = IOUT xR DSON
2
(1)
However, the maximum power dissipation that can be handled by the device depends on the maximum junction to ambient thermal resistance, maximum ambient temperature, and maximum device junction temperature, which can be approximated by the equation below:
PD (max@ TA ) =
( +125C - TA ) JA
(2)
For example at VIN = 5V, the typical RDSON = 80m. For IOUT = 2A, the maximum power dissipation calculated using equation (1) is PD = 0.32W. Based on SOT26 JA = 153C/W and equation (2), the calculated junction temperature rise from ambient is approximately 49C. Since the maximum junction temperature is 125C, the operating ambient temperature must be kept below 76C to safely operate the device. On the other hand, at TA = 85C and VIN = 5V, the calculated maximum power dissipation from equation (2) is approximately PDmax = 0.26W. Hence the safe operating maximum continuous current is 1.81A. For other application conditions, the users should recalculate the device maximum power dissipation based on the operating conditions.
DISCHARGE Operation The AP2281-3 offers discharge option that helps to discharge the output charge when disabled.
AP2281 Rev. 1
8 of 9 www.diodes.com
JANUARY 2008
(c) Diodes Incorporated
AP2281
SINGLE SLEW RATE CONTROLLED LOAD SWITCH
Marking Information
(Top View) 6 5 4 7 3 XX : U2 : AP2281-1 U3 : AP2281-3 Y : Year: 0-9 M : Month: A~L G : Green Package
XX Y M X 1 2 SOT26
Package Information
IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.
AP2281 Rev. 1
9 of 9 www.diodes.com
JANUARY 2008
(c) Diodes Incorporated


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